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    RL150

    RL150??(ULANSI:FR-4.0)Mid-TgLead-Free?/UVBlocking?特點???????????Tg≥150℃無鉛兼容FR-4板材UVBlocking/AOI兼容優良的機械加工性能優秀的耐CAF性能應用領域???????????電腦、儀器儀表、攝像機、通訊設備、電子游戲機、汽車等??FEATURES????Tg≥150℃lead-freecompatibleFR-4b
    所屬分類
    無鉛兼容FR-4
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    nuode

    RL150

     

     

    (UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking

     

    特點            

    1. Tg ≥150℃無鉛兼容FR-4板材
    2. UV Blocking/AOI兼容
    3. 優良的機械加工性能
    4. 優秀的耐CAF性能

    應用領域            
    電腦、儀器儀表、攝像機、通訊設備、
    電子游戲機、汽車等

     

     FEATURES     

    1. Tg ≥ 150 ℃ lead-free compatible FR-4 board
    2. UV Blocking/AOI Compatible
    3. Excellent machinability processability 
    4. Excellent Anti-CAF Performance

     APPLICATIONS     
    Computer,lnstrumentation,VCR,communication equipment,electronic game machine,automotive electronics,and etc。

     

    GENERAL PROPERTIES    

    Test Item

    Test condition

    Units

    Standard value

    Typical value

    1.Peel Strength , IBS/IN,Minimum,1 OZ

     

    IBS/IN

     

     

    As received

    A

    ≥8.0

    12.6

    After thermal stress

    A

    ≥8.0

    12.6

    2. Volume resistivity ,Minimum
    At elevated temperature E-24/125

    E-24/125

    MΩ.cm  

    ≥103

    ≥106

    3. Surface resistivity , Minimum                              
    At elevated temperature E-24/125        

     E-24/125

    ≥103

    ≥106

    4.Water absorption , Maximum

    E-1/105+des

    %

    ≤0.50

    0.13

    5.Dielectric Breakdown, Minimum

    D-48/50 D-0.5/23

    Kv

    ≥40

    43

    6. Flexural strength ,Minimum

     

    Mpa

     

     

    Length direction

    A

    ≥415

    520

    Cross direction

    A

    ≥345

    450

    7.Arc resistance ,Minimum

    D-48/50
    D-0.5/23

    S

    ≥60

    140

    8.Flammability

    A

    S

    UL-94V0

    UL-94V0

    9. Permittivity 1MHZ ,Maximum

    A

     

    ≤5.4

    4.9

    10.Loss tangent 1MHZ ,Maximum

    A

    ---

    ≤0.035

    0.016

    11.Thermal stress 288℃,10sec( Minimum )                    

     

    ---

     

     

    Non etched specimen

    A

    NO DEFECT

    NO DEFECT

    Etched

    A

    NO DEFECT

    NO DEFECT

    12. TG(DSC,℃)

    A

    ≥150

    152

    13. CTI,V

    TEC-112

    V

    ≥175

    200

    Note:
    the treatment of letters and numerical meaning
        A - plate delivery stage
        D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                            Warpage of                                                                              Warpage of

                            (No-treating)                                                                             (After treating:125℃ 2hr)

    nuode                                          nuode

                            Peel strength

                               

      ※Specimen T hickness:1.6mm single side board

    PURCHASING INFORMATION    

     

    Thickness

    Copper foil

    Standard Size

    0.2mm  to  3.4mm

    12μm  to    105μm

    1041×1245mm(41″×49″)    940×1245mm(37″×49″)
    1092×1245mm(43″×49″)   

    ※ Other sheet size and thickness could be available upon request.

     

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